Difference between revisions of "ROM-5880 user guide"

Revision as of 02:25, 28 August 2023

資源特性(Features)

• Rockchip RK3568 Arm Quad Cortex-A55 up to 2.0GHz
• Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC
• Support 1 x HDMI2.0 4K, 1 x signal LVDS or 1 x 2ch MIPI DSI or 1 x eDP
• Support 4K H.264/H.265 Video decoder
• 2 x USB3.0, 2 x USB2.0, 4 x UART, 14 x GPIO
• 2 x PCIe3.0, 1 x SATA, 1 x MIPI CSI, 2 x Gigabit LAN
• Support Linux & Android

簡介（Introduction）

Advantech ROM-5880 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3568 SOC which includes Quad-core Arm Cortex-A55 processors and Arm Mali-G52 3D graphics
engine. It provides rich display interface: HDMI 4K@60Hz, LVDS or DSI or eDP to meet different requirement. It also features USB3.0, PCIe 3.0, SATA, Gigabit Ethernet, MIPI-CSI for
embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.
ROM-5880 is paired with the Advantech SOM-DB2510 SMARC2.1 development board for faster end product peripheral integration and time-to-market. The reference schematics and
layout checklist documentations for carrier board development will be provided along with the open-sourced Linux BSP, test utilities, hardware design utilities and reference drivers.

訂購資訊(Ordering Information)

規格（Specifications）

框圖（Block Diagram）

ROM-5880 Connector Location

Connector List

Debug

Switch

SW1：AT/ATX Mode Selection

SOM-DB2510 A1 Board Dimension Layout

The figures below indicate the main chips on SOM-DB2510 Development Board for  SMARC 2.1.

SOM-DB2510 Connectors and Jumper Settings

Connector Locations

Jumper Locations

Switch Locations

I/O Connctor Locations

Button Locations

LED Locations

SOM-DB2510_A1 接口引脚定義 (Pin definitions)

Jumper,Switch,and Button List

LED Function List

Switch Settings

Connector Pin Definitions

Jumper Settings

ROM-5880 机械尺寸（Mechanical Characteristics）

• Dimension: SMARC form factor size: (D x W) 82 x 50 mm/3.22 x 1.9 in
• Height on top: Under 3.0 mm
• Height on bottom: Under 2.0 mm

SOM-DB2510_A1 机械尺寸 (Mechanical Characteristics)

For more details regarding our 2D/3D models, please visit the Advantech COM support  service website at: http://com.advantech.com.

Board Mechanical Diagram -Front

Board Mechanical Diagram -Side1

Board Mechanical Diagram -Side2

Assemblly Diagram

These figures demonstrate the order of assembly needed when attaching the thermal  module and COM module to the carrier board.

快速入门 (Quick Start)

系统下载 (OS Download)

Note：LIV=Yocto Linux , UIV=Ubuntu，DIV=Debain，AIV=Android 

            LBV=BSP，LIV=Image

• Alpha:  Basic I/O function bring up by RD;

• Beta:  Basic I/O function、performance and middleware verified by RD. Peripherals integrated;

• GA:  Beta version by QE verification;

• RTM:  Beta version by SI/Power/QE verification and pre-loaded;

Debian 燒錄方法 (Debiand Flash eMMC Method)

1.  Using_AndroidTool.

2.  Using bootup_sd_disk made_by SDDiskTool.

User Guide

通用方法(General Method)