Difference between revisions of "ROM-5880 user guide"
Xingxing.li (talk | contribs) |
Xingxing.li (talk | contribs) |
||
| Line 1: | Line 1: | ||
| − | |||
| − | |||
== '''資源特性(Features)''' == | == '''資源特性(Features)''' == | ||
| Line 10: | Line 8: | ||
*2 x USB3.0, 2 x USB2.0, 4 x UART, 14 x GPIO | *2 x USB3.0, 2 x USB2.0, 4 x UART, 14 x GPIO | ||
*2 x PCIe3.0, 1 x SATA, 1 x MIPI CSI, 2 x Gigabit LAN | *2 x PCIe3.0, 1 x SATA, 1 x MIPI CSI, 2 x Gigabit LAN | ||
| − | *Support Linux & Android | + | *Support Linux & Android |
| − | |||
== '''簡介（Introduction）''' == | == '''簡介（Introduction）''' == | ||
| Line 17: | Line 14: | ||
Advantech ROM-5880 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3568 SOC which includes Quad-core Arm Cortex-A55 processors and Arm Mali-G52 3D graphics<br/> engine. It provides rich display interface: HDMI 4K@60Hz, LVDS or DSI or eDP to meet different requirement. It also features USB3.0, PCIe 3.0, SATA, Gigabit Ethernet, MIPI-CSI for<br/> embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.<br/> ROM-5880 is paired with the Advantech SOM-DB2510 SMARC2.1 development board for faster end product peripheral integration and time-to-market. The reference schematics and<br/> layout checklist documentations for carrier board development will be provided along with the open-sourced Linux BSP, test utilities, hardware design utilities and reference drivers. | Advantech ROM-5880 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3568 SOC which includes Quad-core Arm Cortex-A55 processors and Arm Mali-G52 3D graphics<br/> engine. It provides rich display interface: HDMI 4K@60Hz, LVDS or DSI or eDP to meet different requirement. It also features USB3.0, PCIe 3.0, SATA, Gigabit Ethernet, MIPI-CSI for<br/> embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.<br/> ROM-5880 is paired with the Advantech SOM-DB2510 SMARC2.1 development board for faster end product peripheral integration and time-to-market. The reference schematics and<br/> layout checklist documentations for carrier board development will be provided along with the open-sourced Linux BSP, test utilities, hardware design utilities and reference drivers. | ||
| + | == '''訂購資訊(Ordering Information)''' == | ||
| − | + | | |
== '''規格（Specifications）''' == | == '''規格（Specifications）''' == | ||
| Line 27: | Line 25: | ||
| | ||
| − | |||
| − | |||
== '''接口布局和尺寸(Layout and Sizes)''' == | == '''接口布局和尺寸(Layout and Sizes)''' == | ||
| Line 35: | Line 31: | ||
| | ||
| − | |||
| − | |||
=== '''Connector List''' === | === '''Connector List''' === | ||
| Line 77: | Line 71: | ||
插一张AT/ATX mode图片 | 插一张AT/ATX mode图片 | ||
| − | |||
=== '''SOM-DB2510 A1 接口布局圖 Board Dimension Layout''' === | === '''SOM-DB2510 A1 接口布局圖 Board Dimension Layout''' === | ||
| Line 84: | Line 77: | ||
<span style="color:#ff3300;">插一张SOM-DB2510底板的图片</span> | <span style="color:#ff3300;">插一张SOM-DB2510底板的图片</span> | ||
| − | |||
| − | |||
=== '''SOM-DB2510 Connectors and Jumper Settings''' === | === '''SOM-DB2510 Connectors and Jumper Settings''' === | ||
| Line 112: | Line 103: | ||
插一张图片 | 插一张图片 | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
== '''接口引脚定義 (Pin definitions)''' == | == '''接口引脚定義 (Pin definitions)''' == | ||
| − | |||
== '''机械尺寸 ('''Mechanical Characteristics) == | == '''机械尺寸 ('''Mechanical Characteristics) == | ||
| Line 143: | Line 125: | ||
These figures demonstrate the order of assembly needed when attaching the thermal module and COM module to the carrier board. | These figures demonstrate the order of assembly needed when attaching the thermal module and COM module to the carrier board. | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| | ||
Revision as of 07:32, 7 July 2023
Contents
- 1 資源特性(Features)
- 2 簡介（Introduction）
- 3 訂購資訊(Ordering Information)
- 4 規格（Specifications）
- 5 框圖（Block Diagram）
- 6 接口布局和尺寸(Layout and Sizes)
- 7 接口引脚定義 (Pin definitions)
- 8 机械尺寸 (Mechanical Characteristics)
- 9 快速入门 (Quick Start)
- 10 Android 燒錄方法 (Android Flash eMMC Method)
- 11 User Guide
- 12 通用方法(General Method)
- 13
資源特性(Features)
- Rockchip RK3568 Arm Quad Cortex-A55 up to 2.0GHz
- Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC
- Support 1 x HDMI2.0 4K, 1 x signal LVDS or 1 x 2ch MIPI DSI or 1 x eDP
- Support 4K H.264/H.265 Video decoder
- 2 x USB3.0, 2 x USB2.0, 4 x UART, 14 x GPIO
- 2 x PCIe3.0, 1 x SATA, 1 x MIPI CSI, 2 x Gigabit LAN
- Support Linux & Android
簡介（Introduction）
Advantech ROM-5880 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3568 SOC which includes Quad-core Arm Cortex-A55 processors and Arm Mali-G52 3D graphics
engine. It provides rich display interface: HDMI 4K@60Hz, LVDS or DSI or eDP to meet different requirement. It also features USB3.0, PCIe 3.0, SATA, Gigabit Ethernet, MIPI-CSI for
embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.
ROM-5880 is paired with the Advantech SOM-DB2510 SMARC2.1 development board for faster end product peripheral integration and time-to-market. The reference schematics and
layout checklist documentations for carrier board development will be provided along with the open-sourced Linux BSP, test utilities, hardware design utilities and reference drivers.
訂購資訊(Ordering Information)
規格（Specifications）
框圖（Block Diagram）
接口布局和尺寸(Layout and Sizes)
ROM-5880 Connector Location
Connector List
Debug
| Position | Description |
| DEBUG | DEBUG Port |
Switch
| Position | Description |
| SW1 | AT&ATX mode selection |
SW1：AT/ATX Mode Selection
| Setting | Function |
| 1 off 2 on | AT Mode（Default） |
| 1 on 2 off | ATX Mode |
插一张AT/ATX mode图片
SOM-DB2510 A1 接口布局圖 Board Dimension Layout
The figures below indicate the main chips on SOM-DB2510 Development Board for
SMARC 2.1.
插一张SOM-DB2510底板的图片
SOM-DB2510 Connectors and Jumper Settings
Connector Locations
插两张图片
Jumper Locations
插两张图片
Switch Locations
插一张图片
I/O Connctor Locations
插一张图片
Button Locations
插一张图片
LED Locations
插一张图片
接口引脚定義 (Pin definitions)
机械尺寸 (Mechanical Characteristics)
For more details regarding our 2D/3D models, please visit the Advantech COM support service website at: http://com.advantech.com.
Board Mechanical Diagram -Front
Board Mechanical Diagram -Side1
Board Mechanical Diagram -Side2
Assemblly Diagram
These figures demonstrate the order of assembly needed when attaching the thermal module and COM module to the carrier board.
快速入门 (Quick Start)
系统下载 (OS Download)
Android 燒錄方法 (Android Flash eMMC Method)
User Guide