Difference between revisions of "ROM-5880 user guide"

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*RTM:  Beta version by SI/Power/QE verification and pre-loaded;  
 
*RTM:  Beta version by SI/Power/QE verification and pre-loaded;  
  
== '''Debian 燒錄方法 (Debiand Flash eMMC Method)''' ==
+
=== '''Debian 燒錄方法 (Debiand Flash eMMC Method)''' ===
  
 
=== <span style="color:#3498db;">'''1.&nbsp; [[Using_AndroidTool.|Using_AndroidTool.]]'''</span> ===
 
=== <span style="color:#3498db;">'''1.&nbsp; [[Using_AndroidTool.|Using_AndroidTool.]]'''</span> ===

Revision as of 01:56, 13 October 2023

产品特性(Features)

  • Rockchip RK3568 Arm Quad Cortex-A55 up to 2.0GHz
  • Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC
  • Support 1 x HDMI2.0 4K, 1 x signal LVDS or 1 x MIPI DSI 
  • Support 4K H.264/H.265 Video decoder
  • 2 x USB3.0, 2 x USB2.0, 4 x UART, 14 x GPIO
  • 2 x PCIe3.0, 1 x SATA, 1 x MIPI CSI, 2 x Gigabit LAN
  • Support Linux & Android

接口布局和尺寸(Layout and Sizes)

ROM-5880接口布局图 Board Dimension Layout

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Connector List

Debug

Position Description
DEBUG DEBUG Port

Switch

Position Description
SW1 AT&ATX mode selection

SW1:AT/ATX Mode Selection

Setting Function
1 off  2 on AT Mode(Default)
1 on 2 off ATX Mode

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SOM-DB2510 A1 Board Dimension Layout

The figures below indicate the main chips on SOM-DB2510 Development Board for  SMARC 2.1.

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SOM-DB2510 Connectors and Jumper Settings

Connector Locations

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Jumper Locations

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Switch Locations

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I/O Connctor Locations

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Button Locations

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LED Locations

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SOM-DB2510_A1 接口引脚定義 (Pin definitions)

Jumper,Switch,and Button List

LED Function List

Switch Settings

Connector Pin Definitions

Jumper Settings

ROM-5880 机械尺寸(Mechanical Characteristics)

  • Dimension: SMARC form factor size: (D x W) 82 x 50 mm/3.22 x 1.9 in

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  • Height on top: Under 3.0 mm
  • Height on bottom: Under 2.0 mm

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SOM-DB2510_A1 机械尺寸 (Mechanical Characteristics)

For more details regarding our 2D/3D models, please visit the Advantech COM support  service website at: http://com.advantech.com.

Board Mechanical Diagram -Front

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Board Mechanical Diagram -Side1

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Board Mechanical Diagram -Side2

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Assemblly Diagram

These figures demonstrate the order of assembly needed when attaching the thermal  module and COM module to the carrier board.

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可选配件(Optional Accessories)

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快速入门 (Quick Start)

系统下载 (OS Download)

Note:LIV=Yocto Linux , UIV=Ubuntu,DIV=Debain,AIV=Android 

            LBV=BSP,LIV=Image

Platform Product Image Version Release Date Release Version Release notes Image Download BSP Download Tag Comment
RK3568 ROM-5880 AIV12004 2023/08/25 Alpha Release_Note

Baidu      Password:a887

Dropbox

RK3568_S12_AIV12004.xml  
RK3568 ROM-5880 DIV130033 2023/08/29 RTM Release_Note

Baidu      Password:a887

Dropbox

RK3568_RISC_DIV130033.xml   
  • Alpha:  Basic I/O function bring up by RD;
  • Beta:  Basic I/O function、performance and middleware verified by RD. Peripherals integrated;
  • GA:  Beta version by QE verification;
  • RTM:  Beta version by SI/Power/QE verification and pre-loaded;

Debian 燒錄方法 (Debiand Flash eMMC Method)

1.  Using_AndroidTool.

2.  Using bootup_sd_disk made_by SDDiskTool.

User Guide