Difference between revisions of "ROM-5780 user guide Android 7.12"

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There are three ways to update images:
 
There are three ways to update images:
  
=== '''[http://ess-wiki.advantech.com.tw/view/1._Using_AndroidToool. 1._Using_AndroidToool].''' ===
+
=== <u><span style="color:#2980b9;">'''1. Using_AndroidTool.'''</span></u> ===
  
 
There is no limitation by this way.
 
There is no limitation by this way.
  
=== '''[http://ess-wiki.advantech.com.tw/view/2._Using_storage(such_sd_or_USB_disk)with_update.zip_in_it. 2._Using_storage(such&nbsp;sd_or_USB_disk)with_update.zip_in_it.]''' ===
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=== <u><span style="color:#2980b9;">'''2. Using_storage (such sd or USB disk) with update.zip_in_it.'''</span></u> ===
  
 
There are some&nbsp;limitations:
 
There are some&nbsp;limitations:
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(3)Using update.zip to upgrade. (see more detail in "Create OTA zip" on how to create update.zip)
 
(3)Using update.zip to upgrade. (see more detail in "Create OTA zip" on how to create update.zip)
  
=== '''[http://ess-wiki.advantech.com.tw/view/3._Using_bootup_sd_disk_made_by_SDDiskTool. 3._Using_bootup_sd_disk&nbsp;made_by&nbsp;SDDiskTool.]''' ===
+
=== <u>'''<span style="color:#2980b9;">3. Using bootup_sd_disk made_by SDDiskTool.</span>'''</u> ===
  
 
(1)Only update images from the same os,&nbsp; eg&nbsp;:&nbsp;
 
(1)Only update images from the same os,&nbsp; eg&nbsp;:&nbsp;

Revision as of 02:00, 13 April 2023

資源特性(Features)

  • Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz
  • Onboard 2GB LPDDR4 memory and 16GB eMMC
  • Support HDMI2.0 4K 60fps, 1x DP, 1x eDP, 1 x LVDS
  • Support 4K H.264/H.265 Video decoder
  • 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO
  • 1 x PCIe2.0, 1 x SATA, 1 x 4-lane MIPI CSI, Gigabit LAN
  • Support Debian Linux and Android

簡介(Introduction)

Advantech ROM-5780 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3399 SOC which includes dual-core Arm Cortex-A72 and quad-core Arm Cortex-A53 processors
and Arm Mali-T860MP4 3D graphics engine. It provides rich display interface: HDMI 4K@60Hz, eDP and LVDS to meet different requirement. It also features USB3.0, PCIe 2.0, SATA,
Gigabit Ethernet, MIPI-CSI for embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.
ROM-5780 is paired with the Advantech ROM-DB5901 SMARC2.0 development board for faster end product peripheral integration and time-to-market. The reference schematics and
layout checklist documentations for carrier board development will be provided along with the open-sourced Linux BSP, test utilities, hardware design utilities and reference drivers.

訂購資訊(Ordering Information)

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規格(Specifications)

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框圖(Block Diagram)

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接口布局和尺寸(Layout and Sizes)

ROM-5780 接口布局圖 Board Dimension Layout

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Board Connectors

The board has one switch that allows you to configure your system.

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Connector List

Switch

Position Description
SW1 UART & Debug Port selection
SW2 AT& ATX mode selection

SW1: UART & Debug Port Selection

Setting Function
SW1(2-3) Normal UART
SW1(2-1) Debug Console (Default)

SW2: AT/ATX Mode Selection

Setting Function
SW2(2-3) AT Mode (Default)
SW2(2-1) ATX Mode

ROM-DB5901 接口布局圖 Board Dimension Layout

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主板内置插针式引脚排序方式 (Pin Header defination)

Internal I/O

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Position Description Connector Type
BAT1 PIN Header for Battery WAFER 8P 2.54mm 180D(M) DIP
A2543WV2-8P
BH1 RTC Battery Holder BATTERY HOLDER 24.9*23.4*8.9
CR2032 BH800.4GG
CAN1 CANBus Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CAN2 CANBus Port 2 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM1 COM Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM3 COM Port 3 (Debug Port) BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CN4 PCIex1 Connector 1 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN5 PCIex1 Connector 2 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN6 PCIex1 Connector 3 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN11 SATA Connector Serial ATA 7P 1.27mm 180D(M) DIP
WATM-07DBN4A3B8
CN12 SATA Power Connector WAFER 4P 2.5mm 180D(M) DIP
24W1161-04S10-01T
CN22 GPIOx8 sets PIN HEADER 10x2P 2.0mm 180D(M)
DIP 21N22050
CN25 MXM 3.0 Connector MXM Conn. 314P 90D(F) SMD
AS0B821-S78B-7H
CN26 M.2 Key E Slots NGFF 75P 0.5mm 90D(F) H=4.2mm
SMD AS0BC21-S40BE
CN38 FAN (Reserved) WTB Con. 3P 2.54mm 180D(M) DIP
A2543WV0-3P-6T-5e
CN39 MIPI-CSI1 (FPC, 4-Lane FPC 39P, 0.6mm, H0.9mm
CN40 MIPI-CSI0 (FPC, 2-Lane) FPC 39P, 0.6mm, H0.9mm
CN41 MIPI-CSI0 (Mini-SAS, 2-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
CN42 MIPI-CSI1 (Mini-SAS, 4-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
ESPI_CN1 ESPI PIN HEADER 6x2P 2.0mm180D(M) SMD
21N22050-12M00B
I2C_GP_1 I2C Pin Header WAFER BOX 4P 2.00mm 180D(M) DIP
721-81-04TW00
I2C_CN3 Audio Codec Board PIN HEADER 2x10P 2.54mm 180D(M)
DIP 21N22564
LVDS0 LVDS0 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS_BK_PWR LVDS0 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
LVDS1 LVDS1 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS1_BK_PWR LVDS1 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
SD1 SD Card Slot SD CARD 9P 90D(F) SMD WK2192CS3D-
7H
SPI_CN1 SPI Pin Header PIN HEADER 4x2P 2.54mm 180D(M)
SMD 21N22564
SW2 Reset Button TACT SW STS-091 SMD 4P H=3.8mm
SW4 SLP Button TACT SW STS-091 SMD 4P H=3.8mm
SW5 Power Button TACT SW STS-091 SMD 4P H=3.8mm
USB0_OTG1 USB OTG Micro USB 5P/0.65mm/(F)/NY9T/GFL/
RA/S/BK/B
USB-4-5 USB Port 4, Port 5 PIN HEADER 2x5P 2.0mm 180D(M)
SMD 21N22050

Rear I/O

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Position Description Name
DCIN DC Jack A
CN15A UART Port 0 B
CN15B UART Port 2 C
CN1A DP Port D
CN1B HDMI Port E
CN33 Type C Controller Programming Header (Reserved Only) F
CN34 USB Type C G
CN8 GbE Ethernet Connector Port H
CN3 USB Port 1/ 2 I
Audio1 MIC Input/ Audio Output J

接口引脚定義 (Pin definitions)

机械尺寸 (Mechanical Characteristics)

  • Dimensions: SMARC form factor size: (D x W) 82 x 50 mm/ 3.22 x 1.9 in
  • Height on Top: Under 3.0 mm base on SPEC definition (without heat sink)
  • Height on Bottom: Under 1.3 mm base on SPEC definition

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快速入门 (Quick Start)

系统下载 (OS Download)

Android7.12

百度网盘链接:

Image Version Product Date Release Release Note Binary OS Image Name
           


Android 燒錄方法 (Android Flash eMMC Method) 

There are three ways to update images:

1. Using_AndroidTool.

There is no limitation by this way.

2. Using_storage (such sd or USB disk) with update.zip_in_it.

There are some limitations:

(1)The device must be able to boot up to Android system.

(2)Only update images from the same os,  eg : 

        Android6.0 upgrade to Android6.0 or Android7.1 upgrade to Android7.1.

(3)Using update.zip to upgrade. (see more detail in "Create OTA zip" on how to create update.zip)

3. Using bootup_sd_disk made_by SDDiskTool.

(1)Only update images from the same os,  eg : 

         Android6.0 upgrade to Android6.0 or Android7.1 upgrade to Android7.1.

(2)Using update.img to upgrade.