Difference between revisions of "ROM-5780 user guide Android 10"

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== '''資源特性(Features)''' ==
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== '''產品介紹(Product introduction )''' ==
 +
 
 +
=== '''產品特性(Product Features)''' ===
  
 
*Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz  
 
*Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz  
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*Support Debian Linux and Android  
 
*Support Debian Linux and Android  
  
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== '''簡介（Introduction）''' ==
+
== '''產品官網連結(Product official website link) ''' ==
  
−
Advantech ROM-5780 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3399 SOC which includes dual-core Arm Cortex-A72 and quad-core Arm Cortex-A53 processors<br/> and Arm Mali-T860MP4 3D graphics engine. It provides rich display interface: HDMI 4K@60Hz, eDP and LVDS to meet different requirement. It also features USB3.0, PCIe 2.0, SATA,<br/> Gigabit Ethernet, MIPI-CSI for embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.<br/> ROM-5780 is paired with the Advantech ROM-DB5901 SMARC2.0 development board for faster end product peripheral integration and time-to-market. The reference schematics and<br/> layout checklist documentations for carrier board development will be provided along with the open-sourced Linux BSP, test utilities, hardware design utilities and reference drivers.
+
[https://www.advantech.com/zh-tw/products/77b59009-31a9-4751-bee1-45827a844421/rom-5780/mod_74c37d9d-d50c-4d67-a802-952cd5c78d47 '''ROM-5780''']
  
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== '''訂購資訊(Ordering Information)''' ==
+
== '''硬件接口說明(Hardware interface introduction)''' ==
  
−
[[File:ROM-5780 orderinfo.jpg|RTENOTITLE]]
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=== '''接口布局和尺寸(Layout and Sizes)''' ===
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== '''規格（Specifications）''' ==
 
−
 
 
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'''[[File:ROM-5780 Specifications.png|RTENOTITLE]]'''
 
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== '''框圖（Block Diagram）''' ==
 
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<span style="color:#e74c3c">[[File:ROM-5780 Block Diagram.png|RTENOTITLE]]</span>
 
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== '''接口布局和尺寸(Layout and Sizes)''' ==
 
  
 
=== '''ROM-5780 接口布局圖 Board Dimension Layout''' ===
 
=== '''ROM-5780 接口布局圖 Board Dimension Layout''' ===
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&nbsp;
 
&nbsp;
  
 +
&nbsp;
  
 
=== '''Connector List''' ===
 
=== '''Connector List''' ===
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|}
 
|}
  
 +
&nbsp;
  
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=== '''ROM-DB5901 接口布局圖 Board Dimension Layout''' ===
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=== '''ROM-DB5901-SWA2&nbsp;接口布局圖 Board Dimension Layout''' ===
  
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[[File:ROM-DB5901 A2.png]]
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[[File:ROM-DB5901 A2.png|RTENOTITLE]]
  
 
[[File:ROM-DB5901 IO.jpg|RTENOTITLE]]
 
[[File:ROM-DB5901 IO.jpg|RTENOTITLE]]
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=== '''主板内置插针式引脚排序方式 (Pin Header defination)''' ===
 
=== '''主板内置插针式引脚排序方式 (Pin Header defination)''' ===
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−
 
  
 
=== '''Internal I/O''' ===
 
=== '''Internal I/O''' ===
  
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[[File:ROM-DB5901 A2 0.png]]
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[[File:ROM-DB5901 A2 0.png|RTENOTITLE]]
  
 
{|
 
{|
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*[[电源及指示灯和开关机复位按钮(Power_、LED、Power_Button、Reset_Button、Sleep_Button)|电源及指示灯和开关机复位按钮(Power 、LED、Power Button、Reset Button、Sleep Button)]]  
 
*[[电源及指示灯和开关机复位按钮(Power_、LED、Power_Button、Reset_Button、Sleep_Button)|电源及指示灯和开关机复位按钮(Power 、LED、Power Button、Reset Button、Sleep Button)]]  
 
*[[GPIO接口（GPIO_Pin_Header-CN22）|GPIO接口（GPIO Pin Header-CN22）]]  
 
*[[GPIO接口（GPIO_Pin_Header-CN22）|GPIO接口（GPIO Pin Header-CN22）]]  
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*[[MINI_PCIE接口_M.2接口_SPI、I2C_接口|MINI_PCIE接口_M.2接口_SPI、I2C_接口]]
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*[[MINI_PCIE接口_M.2接口_SPI、I2C_接口|MINI_PCIE接口_M.2接口_SPI、I2C_接口]]  
  
 
== '''机械尺寸 ('''Mechanical Characteristics) ==
 
== '''机械尺寸 ('''Mechanical Characteristics) ==
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== '''快速入门 (Quick Start)''' ==
 
== '''快速入门 (Quick Start)''' ==
−
 
  
 
=== '''系统下载 (OS Download)''' ===
 
=== '''系统下载 (OS Download)''' ===
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Note： AIV=Android image&nbsp; ABV=BSP
 
Note： AIV=Android image&nbsp; ABV=BSP
  
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{| border="1" cellpadding="1" cellspacing="1" style="width: 1058px;"
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{| border="1" cellpadding="1" cellspacing="1"
 
|-
 
|-
 +
| '''Platform'''
 
| '''Product'''
 
| '''Product'''
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| style="width: 109px;" | '''Image Version'''
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| '''Image Version'''
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| style="width: 100px;" | '''Release Date'''
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| '''Release Date'''
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| style="width: 118px;" | '''Release Version'''
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| '''Release Version'''
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| style="width: 145px;" | '''Release notes'''
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| '''Release notes'''
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| style="width: 172px;" | '''Image Download'''
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| '''Image Download'''
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| style="width: 214px;" | '''BSP Download Tag'''
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| '''BSP Download Tag'''
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| style="width: 110px;" | '''Comment'''
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| '''Comment'''
 
|-
 
|-
 +
| RK3399
 
| ROM-5780
 
| ROM-5780
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| style="width: 109px;" | AIV1001
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| AIV1001
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| style="width: 100px;" | 2021/04/01
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| 2021/04/01
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| style="width: 118px;" | Beta
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| Beta
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| style="width: 145px;" | &nbsp;
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| NA
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| style="width: 172px;" | [https://pan.baidu.com/s/1CcXMSNN66Q0u4lS_8l6IpA Baidu]&nbsp; Password：a887
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|  
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| style="width: 214px;" | RK3399_Q10_AIV1001.xml
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[https://pan.baidu.com/s/1CcXMSNN66Q0u4lS_8l6IpA Baidu]&nbsp; Password：a887
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| style="width: 110px;" | &nbsp;
+
 
 +
[https://www.dropbox.com/scl/fo/6wqrd9m8x1x7wfmmjhwij/h?dl=0&rlkey=vwspggccbm6f9yn2v8kjl5rs2 Dropbox]
 +
 
 +
| RK3399_Q10_AIV1001.xml
 +
| &nbsp;
 
|}
 
|}
  
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（2）Using update.img to upgrade.
 
（2）Using update.img to upgrade.
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−
 
−
 
−
 
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== '''User Guide''' ==
 
−
 
−
'''Android 10'''
 
−
 
−
*[[Android_BSP_User_Guide_for_ROM-5780_series_Android_10|Android BSP User Guide for ROM-5780 series Android 10]]
 
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*[[Getting_Start|Getting Start]]
 
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*MAC_Address
 
−
 
  
 
== '''通用方法(General Method)''' ==
 
== '''通用方法(General Method)''' ==
−
 
−
 
  
 
== '''乙太網路使用方法(Ethernent Testing Method)''' ==
 
== '''乙太網路使用方法(Ethernent Testing Method)''' ==
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$[60000/1000]</pre>
 
$[60000/1000]</pre>
  
 +
&nbsp;
  
 
== '''查看CPU频率(Check CPU Frequency)''' ==
 
== '''查看CPU频率(Check CPU Frequency)''' ==
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</pre>
 
</pre>
  
−
 
+
&nbsp;
  
 
== '''查看内存容量（Check Memory&nbsp;Capacity)''' ==
 
== '''查看内存容量（Check Memory&nbsp;Capacity)''' ==
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/data/media &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp;25G &nbsp; 64M &nbsp; 25G &nbsp; 1% /mnt/runtime/default/emulated
 
/data/media &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp;25G &nbsp; 64M &nbsp; 25G &nbsp; 1% /mnt/runtime/default/emulated
 
</pre>
 
</pre>
 +
 +
== '''Android BSP編譯方法(Android&nbsp;BSP Compile Method)''' ==
 +
 +
=== [http://ess-wiki.advantech.com.tw/view/Android_BSP_User_Guide_for_rk3399_series_12.0 Android 12.0] ===
 +
 +
=== [http://ess-wiki.advantech.com.tw/view/Android_BSP_User_Guide_for_rk3399_series_10.0 Android 10.0] ===
 +
 +
=== [http://ess-wiki.advantech.com.tw/view/Android_BSP_User_Guide_for_rk3399_series_7.1.2 Android 7.1.2] ===
 +
 +
&nbsp;

Latest revision as of 09:39, 27 March 2024

產品介紹(Product introduction )

產品特性(Product Features)

  • Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz
  • Onboard 2GB LPDDR4 memory and 16GB eMMC
  • Support HDMI2.0 4K 60fps, 1x DP, 1x eDP, 1 x LVDS
  • Support 4K H.264/H.265 Video decoder
  • 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO
  • 1 x PCIe2.0, 1 x SATA, 1 x 4-lane MIPI CSI, Gigabit LAN
  • Support Debian Linux and Android

產品官網連結(Product official website link) 

ROM-5780

硬件接口說明(Hardware interface introduction)

接口布局和尺寸(Layout and Sizes)

ROM-5780 接口布局圖 Board Dimension Layout

RTENOTITLE

Board Connectors

The board has one switch that allows you to configure your system.

RTENOTITLE

 

 

Connector List

Switch

Position Description
SW1 UART & Debug Port selection
SW2 AT & ATX mode selection

SW1: UART & Debug Port Selection

Setting Function
SW1(2-3) Normal UART
SW1(2-1) Debug Console (Default)

SW2: AT/ATX Mode Selection

Setting Function
SW2(2-3) AT Mode (Default)
SW2(2-1) ATX Mode

 

ROM-DB5901-SWA2 接口布局圖 Board Dimension Layout

RTENOTITLE

RTENOTITLE

 

主板内置插针式引脚排序方式 (Pin Header defination)

Internal I/O

RTENOTITLE

Position Description Connector Type
BAT1 PIN Header for Battery WAFER 8P 2.54mm 180D(M) DIP
A2543WV2-8P
BH1 RTC Battery Holder BATTERY HOLDER 24.9*23.4*8.9
CR2032 BH800.4GG
CAN1 CANBus Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CAN2 CANBus Port 2 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM1 COM Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM3 COM Port 3 (Debug Port) BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CN4 PCIex1 Connector 1 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN5 PCIex1 Connector 2 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN6 PCIex1 Connector 3 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN11 SATA Connector Serial ATA 7P 1.27mm 180D(M) DIP
WATM-07DBN4A3B8
CN12 SATA Power Connector WAFER 4P 2.5mm 180D(M) DIP
24W1161-04S10-01T
CN22 GPIOx8 sets PIN HEADER 10x2P 2.0mm 180D(M)
DIP 21N22050
CN25 MXM 3.0 Connector MXM Conn. 314P 90D(F) SMD
AS0B821-S78B-7H
CN26 M.2 Key E Slots NGFF 75P 0.5mm 90D(F) H=4.2mm
SMD AS0BC21-S40BE
CN38 FAN (Reserved) WTB Con. 3P 2.54mm 180D(M) DIP
A2543WV0-3P-6T-5e
CN39 MIPI-CSI1 (FPC, 4-Lane FPC 39P, 0.6mm, H0.9mm
CN40 MIPI-CSI0 (FPC, 2-Lane) FPC 39P, 0.6mm, H0.9mm
CN41 MIPI-CSI0 (Mini-SAS, 2-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
CN42 MIPI-CSI1 (Mini-SAS, 4-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
ESPI_CN1 ESPI PIN HEADER 6x2P 2.0mm180D(M) SMD
21N22050-12M00B
I2C_GP_1 I2C Pin Header WAFER BOX 4P 2.00mm 180D(M) DIP
721-81-04TW00
I2C_CN3 Audio Codec Board PIN HEADER 2x10P 2.54mm 180D(M)
DIP 21N22564
LVDS0 LVDS0 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS_BK_PWR LVDS0 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
LVDS1 LVDS1 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS1_BK_PWR LVDS1 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
SD1 SD Card Slot SD CARD 9P 90D(F) SMD WK2192CS3D-
7H
SPI_CN1 SPI Pin Header PIN HEADER 4x2P 2.54mm 180D(M)
SMD 21N22564
SW2 Reset Button TACT SW STS-091 SMD 4P H=3.8mm
SW4 SLP Button TACT SW STS-091 SMD 4P H=3.8mm
SW5 Power Button TACT SW STS-091 SMD 4P H=3.8mm
USB0_OTG1 USB OTG Micro USB 5P/0.65mm/(F)/NY9T/GFL/
RA/S/BK/B
USB-4-5 USB Port 4, Port 5 PIN HEADER 2x5P 2.0mm 180D(M)
SMD 21N22050

Rear I/O

RTENOTITLE

Position Description Name
DCIN DC Jack A
CN15A UART Port 0 B
CN15B UART Port 2 C
CN1A DP Port D
CN1B HDMI Port E
CN33 Type C Controller Programming Header (Reserved Only) F
CN34 USB Type C G
CN8 GbE Ethernet Connector Port H
CN3 USB Port 1/ 2 I
Audio1 MIC Input/ Audio Output J

接口引脚定義 (Pin definitions)

机械尺寸 (Mechanical Characteristics)

  • Dimensions: SMARC form factor size: (D x W) 82 x 50 mm/ 3.22 x 1.9 in
  • Height on Top: Under 3.0 mm base on SPEC definition (without heat sink)
  • Height on Bottom: Under 1.3 mm base on SPEC definition

RTENOTITLE

 

RTENOTITLE

快速入门 (Quick Start)

系统下载 (OS Download)

Android 10

Note： AIV=Android image  ABV=BSP

Platform Product Image Version Release Date Release Version Release notes Image Download BSP Download Tag Comment
RK3399 ROM-5780 AIV1001 2021/04/01 Beta NA

Baidu  Password：a887

Dropbox

RK3399_Q10_AIV1001.xml  
  • Alpha:  Basic I/O function bring up by RD;
  • Beta:  Basic I/O function、performance and middleware verified by RD. Peripherals integrated;
  • GA:  Beta version by QE verification;
  • RTM:  Beta version by SI/Power/QE verification and pre-loaded;

Android 燒錄方法 (Android Flash eMMC Method)

There are three ways to update images：

1. Using_storage_USB disk with AndroidTool.

There is no limitation by this way.

 

2. Using bootup_sd_disk made_by SDDiskTool.

（1）Only update images from the same os, eg :

Android6.0 upgrade to Android6.0 or Android7.1 upgrade to Android7.1.

（2）Using update.img to upgrade.

通用方法(General Method)

乙太網路使用方法(Ethernent Testing Method)

Command : ifconfig  

console:/ # ifconfig
lo        Link encap:Local Loopback
          inet addr:127.0.0.1  Mask:255.0.0.0
          inet6 addr: ::1/128 Scope: Host
          UP LOOPBACK RUNNING  MTU:65536  Metric:1
          RX packets:0 errors:0 dropped:0 overruns:0 frame:0
          TX packets:0 errors:0 dropped:0 overruns:0 carrier:0
          collisions:0 txqueuelen:1000
          RX bytes:0 TX bytes:0

eth0      Link encap:Ethernet  HWaddr 82:86:01:8c:e0:13  Driver rk_gmac-dwmac
          inet addr:172.21.170.44  Bcast:172.21.171.255  Mask:255.255.254.0
          inet6 addr: fe80::49d8:3769:8043:9181/64 Scope: Link
          UP BROADCAST RUNNING MULTICAST  MTU:1500  Metric:1
          RX packets:26 errors:0 dropped:0 overruns:0 frame:0
          TX packets:19 errors:0 dropped:0 overruns:0 carrier:0
          collisions:0 txqueuelen:1000
          RX bytes:3701 TX bytes:2021
          Interrupt:27

console:/ #

Command : ping 172.21.170.44 

console:/ # ping 172.21.170.44
PING 172.21.170.44 (172.21.170.44) 56(84) bytes of data.
64 bytes from 172.21.170.44: icmp_seq=1 ttl=64 time=0.136 ms
64 bytes from 172.21.170.44: icmp_seq=2 ttl=64 time=0.273 ms
64 bytes from 172.21.170.44: icmp_seq=3 ttl=64 time=0.276 ms
64 bytes from 172.21.170.44: icmp_seq=4 ttl=64 time=0.273 ms
64 bytes from 172.21.170.44: icmp_seq=5 ttl=64 time=0.336 ms
^C
--- 172.21.170.44 ping statistics ---
5 packets transmitted, 5 received, 0% packet loss, time 4076ms
rtt min/avg/max/mdev = 0.136/0.258/0.336/0.069 ms
console:/ #

查看CPU温度(Check CPU Temperature)

console:/ # cat /sys/devices/virtual/thermal/thermal_zone0/temp
60000
console:/ # echo  $[$(cat  /sys/class/thermal/thermal_zone0/temp)/1000]
$[60000/1000]

 

查看CPU频率(Check CPU Frequency)

console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_cur_freq
408000
console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_max_freq
1416000

 

查看内存容量（Check Memory Capacity)

console:/ # busybox free -m
             total         used         free       shared      buffers
Mem:          3840         1312         2528           76            8
-/+ buffers:               1304         2536
Swap:         1920            0         1920

查看存储容量(Check Storage Capacity)

console:/ # df -h
Filesystem            Size  Used Avail Use% Mounted on
tmpfs                 1.8G  616K  1.8G   1% /dev
tmpfs                 1.8G     0  1.8G   0% /mnt
tmpfs                 1.8G     0  1.8G   0% /apex
/dev/block/mmcblk1p12  11M   80K   11M   1% /metadata
/dev/block/dm-0       879M  877M  2.6M 100% /
/dev/block/dm-1       236M  236M  744K 100% /vendor
/dev/block/dm-3       520K  512K  8.0K  99% /odm
/dev/block/dm-2       277M  276M  872K 100% /product
/dev/block/mmcblk1p11 356M  312K  356M   1% /cache
/dev/block/mmcblk1p15  25G   64M   25G   1% /data
/data/media            25G   64M   25G   1% /mnt/runtime/default/emulated

Android BSP編譯方法(Android BSP Compile Method)

Android 12.0

Android 10.0

Android 7.1.2

 

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