Difference between revisions of "ROM-5780 user guide Android 10"

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*[[電池(BAT1)_&_電池扣(BH1)|電池(BAT1) & 電池扣(BH1)]]  
 
*[[電池(BAT1)_&_電池扣(BH1)|電池(BAT1) & 電池扣(BH1)]]  
 
*串口(DEBUG-COM3、COM1)  
 
*串口(DEBUG-COM3、COM1)  
*[[显示接口(LVDS、HDMI)_LAN接口_USB接口(USB1-2、USB3-4、USB_OTG)_音频接口_电源及指示灯和开关机复位按钮_GPIO接口_MINI_PCIE接口_M.2接口_SPI、I2C_接口|显示接口(LVDS、LVDS Backlight、HDMI、DP)]]
+
*顯示接口(LVDS、LVDS Backlight、HDMI、EDP)
*[[LAN接口|LAN接口(LAN)]]
+
*LAN(eth0)
 
*[[USB接口(USB1-2、USB_Type_C、USB_OTG)|USB接口(USB1-2、USB-4-5、USB Type C、USB OTG)]]  
 
*[[USB接口(USB1-2、USB_Type_C、USB_OTG)|USB接口(USB1-2、USB-4-5、USB Type C、USB OTG)]]  
 
*[[音频接口(Audio)|音频接口(Audio Output &Audio Codec)]]  
 
*[[音频接口(Audio)|音频接口(Audio Output &Audio Codec)]]  

Revision as of 04:33, 29 May 2023

資源特性(Features)

  • Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz
  • Onboard 2GB LPDDR4 memory and 16GB eMMC
  • Support HDMI2.0 4K 60fps, 1x DP, 1x eDP, 1 x LVDS
  • Support 4K H.264/H.265 Video decoder
  • 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO
  • 1 x PCIe2.0, 1 x SATA, 1 x 4-lane MIPI CSI, Gigabit LAN
  • Support Debian Linux and Android

簡介(Introduction)

Advantech ROM-5780 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3399 SOC which includes dual-core Arm Cortex-A72 and quad-core Arm Cortex-A53 processors
and Arm Mali-T860MP4 3D graphics engine. It provides rich display interface: HDMI 4K@60Hz, eDP and LVDS to meet different requirement. It also features USB3.0, PCIe 2.0, SATA,
Gigabit Ethernet, MIPI-CSI for embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.
ROM-5780 is paired with the Advantech ROM-DB5901 SMARC2.0 development board for faster end product peripheral integration and time-to-market. The reference schematics and
layout checklist documentations for carrier board development will be provided along with the open-sourced Linux BSP, test utilities, hardware design utilities and reference drivers.

訂購資訊(Ordering Information)

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規格(Specifications)

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框圖(Block Diagram)

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接口布局和尺寸(Layout and Sizes)

ROM-5780 接口布局圖 Board Dimension Layout

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Board Connectors

The board has one switch that allows you to configure your system.

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Connector List

Switch

Position Description
SW1 UART & Debug Port selection
SW2 AT & ATX mode selection

SW1: UART & Debug Port Selection

Setting Function
SW1(2-3) Normal UART
SW1(2-1) Debug Console (Default)

SW2: AT/ATX Mode Selection

Setting Function
SW2(2-3) AT Mode (Default)
SW2(2-1) ATX Mode

ROM-DB5901 接口布局圖 Board Dimension Layout

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主板内置插针式引脚排序方式 (Pin Header defination)

Internal I/O

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Position Description Connector Type
BAT1 PIN Header for Battery WAFER 8P 2.54mm 180D(M) DIP
A2543WV2-8P
BH1 RTC Battery Holder BATTERY HOLDER 24.9*23.4*8.9
CR2032 BH800.4GG
CAN1 CANBus Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CAN2 CANBus Port 2 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM1 COM Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM3 COM Port 3 (Debug Port) BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CN4 PCIex1 Connector 1 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN5 PCIex1 Connector 2 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN6 PCIex1 Connector 3 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN11 SATA Connector Serial ATA 7P 1.27mm 180D(M) DIP
WATM-07DBN4A3B8
CN12 SATA Power Connector WAFER 4P 2.5mm 180D(M) DIP
24W1161-04S10-01T
CN22 GPIOx8 sets PIN HEADER 10x2P 2.0mm 180D(M)
DIP 21N22050
CN25 MXM 3.0 Connector MXM Conn. 314P 90D(F) SMD
AS0B821-S78B-7H
CN26 M.2 Key E Slots NGFF 75P 0.5mm 90D(F) H=4.2mm
SMD AS0BC21-S40BE
CN38 FAN (Reserved) WTB Con. 3P 2.54mm 180D(M) DIP
A2543WV0-3P-6T-5e
CN39 MIPI-CSI1 (FPC, 4-Lane FPC 39P, 0.6mm, H0.9mm
CN40 MIPI-CSI0 (FPC, 2-Lane) FPC 39P, 0.6mm, H0.9mm
CN41 MIPI-CSI0 (Mini-SAS, 2-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
CN42 MIPI-CSI1 (Mini-SAS, 4-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
ESPI_CN1 ESPI PIN HEADER 6x2P 2.0mm180D(M) SMD
21N22050-12M00B
I2C_GP_1 I2C Pin Header WAFER BOX 4P 2.00mm 180D(M) DIP
721-81-04TW00
I2C_CN3 Audio Codec Board PIN HEADER 2x10P 2.54mm 180D(M)
DIP 21N22564
LVDS0 LVDS0 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS_BK_PWR LVDS0 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
LVDS1 LVDS1 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS1_BK_PWR LVDS1 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
SD1 SD Card Slot SD CARD 9P 90D(F) SMD WK2192CS3D-
7H
SPI_CN1 SPI Pin Header PIN HEADER 4x2P 2.54mm 180D(M)
SMD 21N22564
SW2 Reset Button TACT SW STS-091 SMD 4P H=3.8mm
SW4 SLP Button TACT SW STS-091 SMD 4P H=3.8mm
SW5 Power Button TACT SW STS-091 SMD 4P H=3.8mm
USB0_OTG1 USB OTG Micro USB 5P/0.65mm/(F)/NY9T/GFL/
RA/S/BK/B
USB-4-5 USB Port 4, Port 5 PIN HEADER 2x5P 2.0mm 180D(M)
SMD 21N22050


Rear I/O

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Position Description Name
DCIN DC Jack A
CN15A UART Port 0 B
CN15B UART Port 2 C
CN1A DP Port D
CN1B HDMI Port E
CN33 Type C Controller Programming Header (Reserved Only) F
CN34 USB Type C G
CN8 GbE Ethernet Connector Port H
CN3 USB Port 1/ 2 I
Audio1 MIC Input/ Audio Output J

 


接口引脚定義 (Pin definitions)

机械尺寸 (Mechanical Characteristics)

  • Dimensions: SMARC form factor size: (D x W) 82 x 50 mm/ 3.22 x 1.9 in
  • Height on Top: Under 3.0 mm base on SPEC definition (without heat sink)
  • Height on Bottom: Under 1.3 mm base on SPEC definition

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快速入门 (Quick Start)

系统下载 (OS Download)

Android 10

百度网盘链接:

Image Version Product Date Release Release Note Binary OS Image Name
           

 


Android 燒錄方法 (Android Flash eMMC Method)

There are three ways to update images:

1. Using_storage_USB disk with AndroidTool.

There is no limitation by this way.

 

2. Using bootup_sd_disk made_by SDDiskTool.

(1)Only update images from the same os, eg :

Android6.0 upgrade to Android6.0 or Android7.1 upgrade to Android7.1.

(2)Using update.img to upgrade.


User Guide

Android 10

  • Android BSP User Guide for ROM-5780 series Android 10
  • Getting Start
  • MAC_Address