ROM-5780 user guide Android 10

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產品介紹(Product introduction )

產品特性(Product Features)

  • Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz
  • Onboard 2GB LPDDR4 memory and 16GB eMMC
  • Support HDMI2.0 4K 60fps, 1x DP, 1x eDP, 1 x LVDS
  • Support 4K H.264/H.265 Video decoder
  • 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO
  • 1 x PCIe2.0, 1 x SATA, 1 x 4-lane MIPI CSI, Gigabit LAN
  • Support Debian Linux and Android

產品官網連結(Product official website link) 

ROM-5780

硬件接口說明(Hardware interface introduction)

接口布局和尺寸(Layout and Sizes)

ROM-5780 接口布局圖 Board Dimension Layout

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Board Connectors

The board has one switch that allows you to configure your system.

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Connector List

Switch

Position Description
SW1 UART & Debug Port selection
SW2 AT & ATX mode selection

SW1: UART & Debug Port Selection

Setting Function
SW1(2-3) Normal UART
SW1(2-1) Debug Console (Default)

SW2: AT/ATX Mode Selection

Setting Function
SW2(2-3) AT Mode (Default)
SW2(2-1) ATX Mode

 

ROM-DB5901-SWA2 接口布局圖 Board Dimension Layout

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主板内置插针式引脚排序方式 (Pin Header defination)

Internal I/O

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Position Description Connector Type
BAT1 PIN Header for Battery WAFER 8P 2.54mm 180D(M) DIP
A2543WV2-8P
BH1 RTC Battery Holder BATTERY HOLDER 24.9*23.4*8.9
CR2032 BH800.4GG
CAN1 CANBus Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CAN2 CANBus Port 2 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM1 COM Port 1 BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
COM3 COM Port 3 (Debug Port) BOX HEADER 5x2P 2.54mm 180D(M)
DIP 23N6960-10S10
CN4 PCIex1 Connector 1 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN5 PCIex1 Connector 2 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN6 PCIex1 Connector 3 PCIEXPRESS 36P 180D(F) DIP
2EG01817-D2D-DF
CN11 SATA Connector Serial ATA 7P 1.27mm 180D(M) DIP
WATM-07DBN4A3B8
CN12 SATA Power Connector WAFER 4P 2.5mm 180D(M) DIP
24W1161-04S10-01T
CN22 GPIOx8 sets PIN HEADER 10x2P 2.0mm 180D(M)
DIP 21N22050
CN25 MXM 3.0 Connector MXM Conn. 314P 90D(F) SMD
AS0B821-S78B-7H
CN26 M.2 Key E Slots NGFF 75P 0.5mm 90D(F) H=4.2mm
SMD AS0BC21-S40BE
CN38 FAN (Reserved) WTB Con. 3P 2.54mm 180D(M) DIP
A2543WV0-3P-6T-5e
CN39 MIPI-CSI1 (FPC, 4-Lane FPC 39P, 0.6mm, H0.9mm
CN40 MIPI-CSI0 (FPC, 2-Lane) FPC 39P, 0.6mm, H0.9mm
CN41 MIPI-CSI0 (Mini-SAS, 2-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
CN42 MIPI-CSI1 (Mini-SAS, 4-Lane) Mini SAS 36P/0.8mm/(M)/LCP/VA/G15u/
S/BK/W
ESPI_CN1 ESPI PIN HEADER 6x2P 2.0mm180D(M) SMD
21N22050-12M00B
I2C_GP_1 I2C Pin Header WAFER BOX 4P 2.00mm 180D(M) DIP
721-81-04TW00
I2C_CN3 Audio Codec Board PIN HEADER 2x10P 2.54mm 180D(M)
DIP 21N22564
LVDS0 LVDS0 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS_BK_PWR LVDS0 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
LVDS1 LVDS1 Wafer 2x20P/1.25mm/(M)/NY9T/VA/GFL/
S/WH/W
LVDS1_BK_PWR LVDS1 Back Light WAFER BOX 5P 2.0mm 180D(M) DIP
A2001WV2-5P
SD1 SD Card Slot SD CARD 9P 90D(F) SMD WK2192CS3D-
7H
SPI_CN1 SPI Pin Header PIN HEADER 4x2P 2.54mm 180D(M)
SMD 21N22564
SW2 Reset Button TACT SW STS-091 SMD 4P H=3.8mm
SW4 SLP Button TACT SW STS-091 SMD 4P H=3.8mm
SW5 Power Button TACT SW STS-091 SMD 4P H=3.8mm
USB0_OTG1 USB OTG Micro USB 5P/0.65mm/(F)/NY9T/GFL/
RA/S/BK/B
USB-4-5 USB Port 4, Port 5 PIN HEADER 2x5P 2.0mm 180D(M)
SMD 21N22050

Rear I/O

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Position Description Name
DCIN DC Jack A
CN15A UART Port 0 B
CN15B UART Port 2 C
CN1A DP Port D
CN1B HDMI Port E
CN33 Type C Controller Programming Header (Reserved Only) F
CN34 USB Type C G
CN8 GbE Ethernet Connector Port H
CN3 USB Port 1/ 2 I
Audio1 MIC Input/ Audio Output J

接口引脚定義 (Pin definitions)

机械尺寸 (Mechanical Characteristics)

  • Dimensions: SMARC form factor size: (D x W) 82 x 50 mm/ 3.22 x 1.9 in
  • Height on Top: Under 3.0 mm base on SPEC definition (without heat sink)
  • Height on Bottom: Under 1.3 mm base on SPEC definition

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快速入门 (Quick Start)

系统下载 (OS Download)

Android 10

Note: AIV=Android image  ABV=BSP

Platform Product Image Version Release Date Release Version Release notes Image Download BSP Download Tag Comment
RK3399 ROM-5780 AIV1001 2021/04/01 Beta NA

Baidu  Password:a887

Dropbox

RK3399_Q10_AIV1001.xml  
  • Alpha:  Basic I/O function bring up by RD;
  • Beta:  Basic I/O function、performance and middleware verified by RD. Peripherals integrated;
  • GA:  Beta version by QE verification;
  • RTM:  Beta version by SI/Power/QE verification and pre-loaded;

Android 燒錄方法 (Android Flash eMMC Method)

There are three ways to update images:

1. Using_storage_USB disk with AndroidTool.

There is no limitation by this way.

 

2. Using bootup_sd_disk made_by SDDiskTool.

(1)Only update images from the same os, eg :

Android6.0 upgrade to Android6.0 or Android7.1 upgrade to Android7.1.

(2)Using update.img to upgrade.

通用方法(General Method)

乙太網路使用方法(Ethernent Testing Method)

Command : ifconfig 

console:/ # ifconfig
lo        Link encap:Local Loopback
          inet addr:127.0.0.1  Mask:255.0.0.0
          inet6 addr: ::1/128 Scope: Host
          UP LOOPBACK RUNNING  MTU:65536  Metric:1
          RX packets:0 errors:0 dropped:0 overruns:0 frame:0
          TX packets:0 errors:0 dropped:0 overruns:0 carrier:0
          collisions:0 txqueuelen:1000
          RX bytes:0 TX bytes:0

eth0      Link encap:Ethernet  HWaddr 82:86:01:8c:e0:13  Driver rk_gmac-dwmac
          inet addr:172.21.170.44  Bcast:172.21.171.255  Mask:255.255.254.0
          inet6 addr: fe80::49d8:3769:8043:9181/64 Scope: Link
          UP BROADCAST RUNNING MULTICAST  MTU:1500  Metric:1
          RX packets:26 errors:0 dropped:0 overruns:0 frame:0
          TX packets:19 errors:0 dropped:0 overruns:0 carrier:0
          collisions:0 txqueuelen:1000
          RX bytes:3701 TX bytes:2021
          Interrupt:27

console:/ #

Command : ping 172.21.170.44

console:/ # ping 172.21.170.44
PING 172.21.170.44 (172.21.170.44) 56(84) bytes of data.
64 bytes from 172.21.170.44: icmp_seq=1 ttl=64 time=0.136 ms
64 bytes from 172.21.170.44: icmp_seq=2 ttl=64 time=0.273 ms
64 bytes from 172.21.170.44: icmp_seq=3 ttl=64 time=0.276 ms
64 bytes from 172.21.170.44: icmp_seq=4 ttl=64 time=0.273 ms
64 bytes from 172.21.170.44: icmp_seq=5 ttl=64 time=0.336 ms
^C
--- 172.21.170.44 ping statistics ---
5 packets transmitted, 5 received, 0% packet loss, time 4076ms
rtt min/avg/max/mdev = 0.136/0.258/0.336/0.069 ms
console:/ #

查看CPU温度(Check CPU Temperature)

console:/ # cat /sys/devices/virtual/thermal/thermal_zone0/temp
60000
console:/ # echo  $[$(cat  /sys/class/thermal/thermal_zone0/temp)/1000]
$[60000/1000]

 

查看CPU频率(Check CPU Frequency)

console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_cur_freq
408000
console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_max_freq
1416000

 

查看内存容量(Check Memory Capacity)

console:/ # busybox free -m
             total         used         free       shared      buffers
Mem:          3840         1312         2528           76            8
-/+ buffers:               1304         2536
Swap:         1920            0         1920

查看存储容量(Check Storage Capacity)

console:/ # df -h
Filesystem            Size  Used Avail Use% Mounted on
tmpfs                 1.8G  616K  1.8G   1% /dev
tmpfs                 1.8G     0  1.8G   0% /mnt
tmpfs                 1.8G     0  1.8G   0% /apex
/dev/block/mmcblk1p12  11M   80K   11M   1% /metadata
/dev/block/dm-0       879M  877M  2.6M 100% /
/dev/block/dm-1       236M  236M  744K 100% /vendor
/dev/block/dm-3       520K  512K  8.0K  99% /odm
/dev/block/dm-2       277M  276M  872K 100% /product
/dev/block/mmcblk1p11 356M  312K  356M   1% /cache
/dev/block/mmcblk1p15  25G   64M   25G   1% /data
/data/media            25G   64M   25G   1% /mnt/runtime/default/emulated

Android BSP編譯方法(Android BSP Compile Method)

Android 12.0

Android 10.0

Android 7.1.2