Difference between revisions of "ROM-5780 user guide Android 10"
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− | == ''' | + | == '''產品介紹(Product introduction )''' == |
+ | |||
+ | === '''產品特性(Product Features)''' === | ||
*Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz | *Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz | ||
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*Support Debian Linux and Android | *Support Debian Linux and Android | ||
− | == ''' | + | == '''產品官網連結(Product official website link) ''' == |
− | |||
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− | + | [https://www.advantech.com/zh-tw/products/77b59009-31a9-4751-bee1-45827a844421/rom-5780/mod_74c37d9d-d50c-4d67-a802-952cd5c78d47 '''ROM-5780'''] | |
− | + | == '''硬件接口說明(Hardware interface introduction)''' == | |
− | == '''接口布局和尺寸(Layout and Sizes)''' == | + | === '''接口布局和尺寸(Layout and Sizes)''' === |
=== '''ROM-5780 接口布局圖 Board Dimension Layout''' === | === '''ROM-5780 接口布局圖 Board Dimension Layout''' === | ||
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+ | | ||
=== '''Connector List''' === | === '''Connector List''' === | ||
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|} | |} | ||
− | === '''ROM-DB5901 接口布局圖 Board Dimension Layout''' === | + | |
+ | |||
+ | === '''ROM-DB5901-SWA2 接口布局圖 Board Dimension Layout''' === | ||
− | [[File: | + | [[File:ROM-DB5901 A2.png|RTENOTITLE]] |
[[File:ROM-DB5901 IO.jpg|RTENOTITLE]] | [[File:ROM-DB5901 IO.jpg|RTENOTITLE]] | ||
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=== '''主板内置插针式引脚排序方式 (Pin Header defination)''' === | === '''主板内置插针式引脚排序方式 (Pin Header defination)''' === | ||
− | |||
=== '''Internal I/O''' === | === '''Internal I/O''' === | ||
− | [[File:ROM-DB5901 | + | [[File:ROM-DB5901 A2 0.png|RTENOTITLE]] |
{| | {| | ||
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|} | |} | ||
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=== '''Rear I/O''' === | === '''Rear I/O''' === | ||
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| J | | J | ||
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== '''接口引脚定義 (Pin definitions)''' == | == '''接口引脚定義 (Pin definitions)''' == | ||
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*[[电源及指示灯和开关机复位按钮(Power_、LED、Power_Button、Reset_Button、Sleep_Button)|电源及指示灯和开关机复位按钮(Power 、LED、Power Button、Reset Button、Sleep Button)]] | *[[电源及指示灯和开关机复位按钮(Power_、LED、Power_Button、Reset_Button、Sleep_Button)|电源及指示灯和开关机复位按钮(Power 、LED、Power Button、Reset Button、Sleep Button)]] | ||
*[[GPIO接口(GPIO_Pin_Header-CN22)|GPIO接口(GPIO Pin Header-CN22)]] | *[[GPIO接口(GPIO_Pin_Header-CN22)|GPIO接口(GPIO Pin Header-CN22)]] | ||
− | *[[MINI_PCIE接口_M.2接口_SPI、I2C_接口|MINI_PCIE接口_M.2接口_SPI、I2C_接口]] | + | *[[MINI_PCIE接口_M.2接口_SPI、I2C_接口|MINI_PCIE接口_M.2接口_SPI、I2C_接口]] |
== '''机械尺寸 ('''Mechanical Characteristics) == | == '''机械尺寸 ('''Mechanical Characteristics) == | ||
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== '''快速入门 (Quick Start)''' == | == '''快速入门 (Quick Start)''' == | ||
+ | === '''系统下载 (OS Download)''' === | ||
− | |||
=== '''Android 10''' === | === '''Android 10''' === | ||
− | + | Note: AIV=Android image ABV=BSP | |
− | {| border="1" cellpadding="1" cellspacing="1 | + | {| border="1" cellpadding="1" cellspacing="1" |
|- | |- | ||
− | + | | '''Platform''' | |
− | + | | '''Product''' | |
− | | | + | | '''Image Version''' |
− | | | + | | '''Release Date''' |
− | | | + | | '''Release Version''' |
− | + | | '''Release notes''' | |
+ | | '''Image Download''' | ||
+ | | '''BSP Download Tag''' | ||
+ | | '''Comment''' | ||
|- | |- | ||
− | | | + | | RK3399 |
− | | | + | | ROM-5780 |
− | | | + | | AIV1001 |
− | | | + | | 2021/04/01 |
− | + | | Beta | |
− | | | + | | NA |
+ | | | ||
+ | [https://pan.baidu.com/s/1CcXMSNN66Q0u4lS_8l6IpA Baidu] Password:a887 | ||
+ | |||
+ | [https://www.dropbox.com/scl/fo/6wqrd9m8x1x7wfmmjhwij/h?dl=0&rlkey=vwspggccbm6f9yn2v8kjl5rs2 Dropbox] | ||
+ | |||
+ | | RK3399_Q10_AIV1001.xml | ||
+ | | | ||
|} | |} | ||
− | | + | *Alpha: Basic I/O function bring up by RD; |
+ | |||
+ | *Beta: Basic I/O function、performance and middleware verified by RD. Peripherals integrated; | ||
+ | *GA: Beta version by QE verification; | ||
+ | *RTM: Beta version by SI/Power/QE verification and pre-loaded; | ||
== '''Android 燒錄方法 (Android Flash eMMC Method)''' == | == '''Android 燒錄方法 (Android Flash eMMC Method)''' == | ||
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(2)Using update.img to upgrade. | (2)Using update.img to upgrade. | ||
+ | == '''通用方法(General Method)''' == | ||
+ | |||
+ | == '''乙太網路使用方法(Ethernent Testing Method)''' == | ||
+ | |||
+ | '''Command : ifconfig ''' | ||
+ | <pre>console:/ # ifconfig | ||
+ | lo Link encap:Local Loopback | ||
+ | inet addr:127.0.0.1 Mask:255.0.0.0 | ||
+ | inet6 addr: ::1/128 Scope: Host | ||
+ | UP LOOPBACK RUNNING MTU:65536 Metric:1 | ||
+ | RX packets:0 errors:0 dropped:0 overruns:0 frame:0 | ||
+ | TX packets:0 errors:0 dropped:0 overruns:0 carrier:0 | ||
+ | collisions:0 txqueuelen:1000 | ||
+ | RX bytes:0 TX bytes:0 | ||
+ | |||
+ | eth0 Link encap:Ethernet HWaddr 82:86:01:8c:e0:13 Driver rk_gmac-dwmac | ||
+ | inet addr:172.21.170.44 Bcast:172.21.171.255 Mask:255.255.254.0 | ||
+ | inet6 addr: fe80::49d8:3769:8043:9181/64 Scope: Link | ||
+ | UP BROADCAST RUNNING MULTICAST MTU:1500 Metric:1 | ||
+ | RX packets:26 errors:0 dropped:0 overruns:0 frame:0 | ||
+ | TX packets:19 errors:0 dropped:0 overruns:0 carrier:0 | ||
+ | collisions:0 txqueuelen:1000 | ||
+ | RX bytes:3701 TX bytes:2021 | ||
+ | Interrupt:27 | ||
− | + | console:/ # | |
+ | </pre> | ||
− | ''' | + | '''Command : ping 172.21.170.44''' |
+ | <pre>console:/ # ping 172.21.170.44 | ||
+ | PING 172.21.170.44 (172.21.170.44) 56(84) bytes of data. | ||
+ | 64 bytes from 172.21.170.44: icmp_seq=1 ttl=64 time=0.136 ms | ||
+ | 64 bytes from 172.21.170.44: icmp_seq=2 ttl=64 time=0.273 ms | ||
+ | 64 bytes from 172.21.170.44: icmp_seq=3 ttl=64 time=0.276 ms | ||
+ | 64 bytes from 172.21.170.44: icmp_seq=4 ttl=64 time=0.273 ms | ||
+ | 64 bytes from 172.21.170.44: icmp_seq=5 ttl=64 time=0.336 ms | ||
+ | ^C | ||
+ | --- 172.21.170.44 ping statistics --- | ||
+ | 5 packets transmitted, 5 received, 0% packet loss, time 4076ms | ||
+ | rtt min/avg/max/mdev = 0.136/0.258/0.336/0.069 ms | ||
+ | console:/ #</pre> | ||
− | + | == '''查看CPU温度(Check CPU Temperature)''' == | |
− | + | <pre>console:/ # cat /sys/devices/virtual/thermal/thermal_zone0/temp | |
− | + | 60000 | |
+ | console:/ # echo $[$(cat /sys/class/thermal/thermal_zone0/temp)/1000] | ||
+ | $[60000/1000]</pre> | ||
+ | |||
+ | | ||
+ | |||
+ | == '''查看CPU频率(Check CPU Frequency)''' == | ||
+ | <pre>console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_cur_freq | ||
+ | 408000 | ||
+ | console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_max_freq | ||
+ | 1416000 | ||
+ | </pre> | ||
+ | |||
+ | | ||
+ | |||
+ | == '''查看内存容量(Check Memory Capacity)''' == | ||
+ | <pre>console:/ # busybox free -m | ||
+ | total used free shared buffers | ||
+ | Mem: 3840 1312 2528 76 8 | ||
+ | -/+ buffers: 1304 2536 | ||
+ | Swap: 1920 0 1920 | ||
+ | </pre> | ||
+ | |||
+ | == '''查看存储容量(Check Storage Capacity)''' == | ||
+ | <pre>console:/ # df -h | ||
+ | Filesystem Size Used Avail Use% Mounted on | ||
+ | tmpfs 1.8G 616K 1.8G 1% /dev | ||
+ | tmpfs 1.8G 0 1.8G 0% /mnt | ||
+ | tmpfs 1.8G 0 1.8G 0% /apex | ||
+ | /dev/block/mmcblk1p12 11M 80K 11M 1% /metadata | ||
+ | /dev/block/dm-0 879M 877M 2.6M 100% / | ||
+ | /dev/block/dm-1 236M 236M 744K 100% /vendor | ||
+ | /dev/block/dm-3 520K 512K 8.0K 99% /odm | ||
+ | /dev/block/dm-2 277M 276M 872K 100% /product | ||
+ | /dev/block/mmcblk1p11 356M 312K 356M 1% /cache | ||
+ | /dev/block/mmcblk1p15 25G 64M 25G 1% /data | ||
+ | /data/media 25G 64M 25G 1% /mnt/runtime/default/emulated | ||
+ | </pre> | ||
+ | |||
+ | == '''Android BSP編譯方法(Android BSP Compile Method)''' == | ||
+ | |||
+ | === [http://ess-wiki.advantech.com.tw/view/Android_BSP_User_Guide_for_rk3399_series_12.0 Android 12.0] === | ||
+ | |||
+ | === [http://ess-wiki.advantech.com.tw/view/Android_BSP_User_Guide_for_rk3399_series_10.0 Android 10.0] === | ||
+ | |||
+ | === [http://ess-wiki.advantech.com.tw/view/Android_BSP_User_Guide_for_rk3399_series_7.1.2 Android 7.1.2] === | ||
+ | |||
+ | |
Latest revision as of 08:39, 27 March 2024
Contents
- 1 產品介紹(Product introduction )
- 2 產品官網連結(Product official website link)
- 3 硬件接口說明(Hardware interface introduction)
- 4 接口引脚定義 (Pin definitions)
- 5 机械尺寸 (Mechanical Characteristics)
- 6 快速入门 (Quick Start)
- 7 Android 燒錄方法 (Android Flash eMMC Method)
- 8 通用方法(General Method)
- 9 乙太網路使用方法(Ethernent Testing Method)
- 10 查看CPU温度(Check CPU Temperature)
- 11 查看CPU频率(Check CPU Frequency)
- 12 查看内存容量(Check Memory Capacity)
- 13 查看存储容量(Check Storage Capacity)
- 14 Android BSP編譯方法(Android BSP Compile Method)
產品介紹(Product introduction )
產品特性(Product Features)
- Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz
- Onboard 2GB LPDDR4 memory and 16GB eMMC
- Support HDMI2.0 4K 60fps, 1x DP, 1x eDP, 1 x LVDS
- Support 4K H.264/H.265 Video decoder
- 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO
- 1 x PCIe2.0, 1 x SATA, 1 x 4-lane MIPI CSI, Gigabit LAN
- Support Debian Linux and Android
產品官網連結(Product official website link)
硬件接口說明(Hardware interface introduction)
接口布局和尺寸(Layout and Sizes)
ROM-5780 接口布局圖 Board Dimension Layout
Board Connectors
The board has one switch that allows you to configure your system.
Connector List
Switch
Position | Description |
SW1 | UART & Debug Port selection |
SW2 | AT & ATX mode selection |
SW1: UART & Debug Port Selection
Setting | Function |
SW1(2-3) | Normal UART |
SW1(2-1) | Debug Console (Default) |
SW2: AT/ATX Mode Selection
Setting | Function |
SW2(2-3) | AT Mode (Default) |
SW2(2-1) | ATX Mode |
ROM-DB5901-SWA2 接口布局圖 Board Dimension Layout
主板内置插针式引脚排序方式 (Pin Header defination)
Internal I/O
|
Rear I/O
Position | Description | Name |
DCIN | DC Jack | A |
CN15A | UART Port 0 | B |
CN15B | UART Port 2 | C |
CN1A | DP Port | D |
CN1B | HDMI Port | E |
CN33 | Type C Controller Programming Header (Reserved Only) | F |
CN34 | USB Type C | G |
CN8 | GbE Ethernet Connector Port | H |
CN3 | USB Port 1/ 2 | I |
Audio1 | MIC Input/ Audio Output | J |
接口引脚定義 (Pin definitions)
- 電池(BAT1) & 電池扣(BH1)
- 串口(DEBUG-COM3、COM1)
- 顯示接口(LVDS、LVDS Backlight、HDMI、EDP)
- LAN(eth0)
- USB接口(USB1-2、USB-4-5、USB Type C、USB OTG)
- 音頻接口(Audio Output & Audio Codec)
- 电源及指示灯和开关机复位按钮(Power 、LED、Power Button、Reset Button、Sleep Button)
- GPIO接口(GPIO Pin Header-CN22)
- MINI_PCIE接口_M.2接口_SPI、I2C_接口
机械尺寸 (Mechanical Characteristics)
- Dimensions: SMARC form factor size: (D x W) 82 x 50 mm/ 3.22 x 1.9 in
- Height on Top: Under 3.0 mm base on SPEC definition (without heat sink)
- Height on Bottom: Under 1.3 mm base on SPEC definition
快速入门 (Quick Start)
系统下载 (OS Download)
Android 10
Note: AIV=Android image ABV=BSP
Platform | Product | Image Version | Release Date | Release Version | Release notes | Image Download | BSP Download Tag | Comment |
RK3399 | ROM-5780 | AIV1001 | 2021/04/01 | Beta | NA |
Baidu Password:a887 |
RK3399_Q10_AIV1001.xml |
- Alpha: Basic I/O function bring up by RD;
- Beta: Basic I/O function、performance and middleware verified by RD. Peripherals integrated;
- GA: Beta version by QE verification;
- RTM: Beta version by SI/Power/QE verification and pre-loaded;
Android 燒錄方法 (Android Flash eMMC Method)
There are three ways to update images:
1. Using_storage_USB disk with AndroidTool.
There is no limitation by this way.
2. Using bootup_sd_disk made_by SDDiskTool.
(1)Only update images from the same os, eg :
Android6.0 upgrade to Android6.0 or Android7.1 upgrade to Android7.1.
(2)Using update.img to upgrade.
通用方法(General Method)
乙太網路使用方法(Ethernent Testing Method)
Command : ifconfig
console:/ # ifconfig lo Link encap:Local Loopback inet addr:127.0.0.1 Mask:255.0.0.0 inet6 addr: ::1/128 Scope: Host UP LOOPBACK RUNNING MTU:65536 Metric:1 RX packets:0 errors:0 dropped:0 overruns:0 frame:0 TX packets:0 errors:0 dropped:0 overruns:0 carrier:0 collisions:0 txqueuelen:1000 RX bytes:0 TX bytes:0 eth0 Link encap:Ethernet HWaddr 82:86:01:8c:e0:13 Driver rk_gmac-dwmac inet addr:172.21.170.44 Bcast:172.21.171.255 Mask:255.255.254.0 inet6 addr: fe80::49d8:3769:8043:9181/64 Scope: Link UP BROADCAST RUNNING MULTICAST MTU:1500 Metric:1 RX packets:26 errors:0 dropped:0 overruns:0 frame:0 TX packets:19 errors:0 dropped:0 overruns:0 carrier:0 collisions:0 txqueuelen:1000 RX bytes:3701 TX bytes:2021 Interrupt:27 console:/ #
Command : ping 172.21.170.44
console:/ # ping 172.21.170.44 PING 172.21.170.44 (172.21.170.44) 56(84) bytes of data. 64 bytes from 172.21.170.44: icmp_seq=1 ttl=64 time=0.136 ms 64 bytes from 172.21.170.44: icmp_seq=2 ttl=64 time=0.273 ms 64 bytes from 172.21.170.44: icmp_seq=3 ttl=64 time=0.276 ms 64 bytes from 172.21.170.44: icmp_seq=4 ttl=64 time=0.273 ms 64 bytes from 172.21.170.44: icmp_seq=5 ttl=64 time=0.336 ms ^C --- 172.21.170.44 ping statistics --- 5 packets transmitted, 5 received, 0% packet loss, time 4076ms rtt min/avg/max/mdev = 0.136/0.258/0.336/0.069 ms console:/ #
查看CPU温度(Check CPU Temperature)
console:/ # cat /sys/devices/virtual/thermal/thermal_zone0/temp 60000 console:/ # echo $[$(cat /sys/class/thermal/thermal_zone0/temp)/1000] $[60000/1000]
查看CPU频率(Check CPU Frequency)
console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_cur_freq 408000 console:/ # cat /sys//devices/system/cpu/cpu0/cpufreq/cpuinfo_max_freq 1416000
查看内存容量(Check Memory Capacity)
console:/ # busybox free -m total used free shared buffers Mem: 3840 1312 2528 76 8 -/+ buffers: 1304 2536 Swap: 1920 0 1920
查看存储容量(Check Storage Capacity)
console:/ # df -h Filesystem Size Used Avail Use% Mounted on tmpfs 1.8G 616K 1.8G 1% /dev tmpfs 1.8G 0 1.8G 0% /mnt tmpfs 1.8G 0 1.8G 0% /apex /dev/block/mmcblk1p12 11M 80K 11M 1% /metadata /dev/block/dm-0 879M 877M 2.6M 100% / /dev/block/dm-1 236M 236M 744K 100% /vendor /dev/block/dm-3 520K 512K 8.0K 99% /odm /dev/block/dm-2 277M 276M 872K 100% /product /dev/block/mmcblk1p11 356M 312K 356M 1% /cache /dev/block/mmcblk1p15 25G 64M 25G 1% /data /data/media 25G 64M 25G 1% /mnt/runtime/default/emulated
Android BSP編譯方法(Android BSP Compile Method)
Android 12.0
Android 10.0
Android 7.1.2